Available processes:
- TCS (SiHCl3) Low Growth rate n and p type
- TCS (SiHCl3) High growth rate n and p type
- Silane (SIH4) Standard Growth rate n and p type
- Multi Epitaxy structures n and p type including high thicknesses
- Doped and undoped 3C SiC on Si
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Some examples of current capabilities
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Characterization capability:
Epitaxial metrology services with a full characterization of SiC Epitaxy layers:
- Layer thickness mapping: FTIR QS2200
- Carrier concentration mapping and in-depth profiling: CV Mercury probe SSM 495
- Nikon automatic inspection for defects mapping (bright field, dark field, DIC, confocal)
In the SiCilab:
- X-Ray diffraction
- Polar figures
- Rocking curve maps
- Stress measurements
- Optical characterization
- µ-Raman map
- µ-Photoluminescence map
- time-resolved photoluminescence
- Electrical characterization
- I-V and C-V by device test patterns
- DLTS
- Stress characterization by test structures (3C-SiC)
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SiC Characterization line
FTIR & HG CV equipments
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Applications:
In addition to a fast turnaround and high yield on developed products, ETC also offers:
- Reactor process time for custom process development
- Support for facilities design and SiC Tools installation
- Support for any application using 4H and 3C silicon carbide
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